Added to cart

product image
Go to cart

Your order qualifies for free 2-day shipping and easy returns

Size, Weight, and Power Optimized Design

  • Industry-Leading Thermal and Visible Camera Performance

    Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.

  • Built for Integrators

    Reduce development cost and time to market with a solution from a single, reliable supplier.

  • Optimize design and operation time with compact, lightweight, and low-power module.

    The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ LWIR camera portfolio.

Integrate Thermal Faster

Integrate Thermal Faster

Maximize efficiency with the NEW Hadron 640R Development Kits. The new development kits enable integrators to start imaging with the SWaP-optimized Hadron 640R radiometric thermal and visible cameras within just hours using the NVIDIA Jetson Nano, the Qualcomm RB5, and the Qualcomm 865.

Thermal Imaging Detector
Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
Temperature Accuracy
±5°C less, over 0°C to 100°C range.
Temperature Accuracy
±5°C less, over 0°C to 100°C range.
Imaging & Optical
EO Camera Optics
Effective Focal Length (EFL) 4.8 mm, 67° HFOV, F/# 1/2.3
EO Camera Sensor
9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
EO Camera Video
Full resolution @ 60 Hz
ICM20602, I2C or SPI (selectable)
IR Camera Optics
Effective Focal Length (EFL) 13.6mm, 32° HFOV, F/# 1.0
IR Camera Video
Full resolution @ 60Hz
Thermal Imaging Detector
Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
Connections & Communications
Software Drivers
NVIDIA Jetson Nano
Qualcomm Snapdragon rb5
Qualcomm Snapdragon 865

*Contact Teledyne FLIR for latest software drivers
Electrical Interface
Hirose DF40C-50DP-0.4V (51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V (51)
5V, typical power dissipation <1800 mW, Max <2900 mW
Mechanical Interface
Screw mount to back plate
Size (w/o lens)
35 x 49 x 45 mm (1.38” x 1.93” x 1.77”)
56 g
Environmental & Approvals
Environmental Sealing
IP54 (with the rear interfaces sealed)
Operational & Storage Temperature
-20°C to +60°C
Tested EMI Performance
FCC part 15 Class B

Media gallery

Getting Started with NVIDIA Jetson Nano
Getting Started with Qualcomm RB5
Related Documents
Export Restrictions

Export Restrictions

The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.

Hadron™ 640R